FSC-BT1026C Qualcomm QCC3024 BT5.1 Audio Receiver Module TWS
FSC-BT1026C is a dual-mode Bluetooth 5.1 stereo audio SoC module based on Qualcomm’s QCC3024 Bluetooth audio chip, designed specifically for wireless audio applications. The module integrates Bluetooth 5.1 dual-mode (BR/EDR + BLE) technology, supports Bluetooth protocols including A2DP, AVRCP, HFP, HSP, SPP, GATT and PBAP, supports high quality audio transmission and low power Bluetooth connection. It can be widely used in wireless headphones, Bluetooth speakers, Car Bluetooth and other products.
- Qualified Bluetooth® v5.1 specification
- 120MHz Qualcomm® Kalimba™ audio DSP
- 32MHz developer processor for applications
- Firmware Processor for system
- Flexible QSPI flash programmable platform
- High-performance 24‑bit stereo audio interface
- Digital and analog microphone interfaces
- Flexible PIO controller and LED pins with PWM support
- Supports UART, Bit Serializer (I²C/SPI), and USB 2.0 serial interfaces
- Advanced audio algorithms
- 1 or 2-mic Qualcomm@ cVc™ headset noise reduction and echo cancellation technology
- Supports Qualcomm@ broadcast audio technology technology
- Supports SBC and AAC audio codecs
- Integrated PMU with dual SMPS for system/digital circuits and integrated Li-ion battery charger
| Bluetooth Audio Module | FSC-BT1026C |
|---|---|
| Chipset | Qualcomm QCC3024 |
| Bluetooth Standard | Dual-mode Bluetooth 5.1 |
| Size (mm) | 13 × 26.9 × 2.2 |
| Transmit Output Power | +9 dBm (Max.) |
| Profiles | A2DP, AVRCP, HFP, HSP, HOGP, PBAP, SPP, GATT |
| Certification | CE, FCC, IC, KC, TELEC, BQB, NCC, SRRC |
| Frequency Band | 2.402~2.480GHz |
| Audio Codecs | SBC, AAC |
| Operating Temperature | -40 °C to +85 °C |
| Storage Temperature | -40 °C to +85 °C |
Firmware
| Firmware No. | Application | Profiles |
|---|---|---|
| FSC-BT1026C | Audio & Data | HFP, A2DP, AVRCP, PBAP, BLE, SPP, OTA |
| FSC-BT1026C | Audio (TWS) & Data | HFP, A2DP, AVRCP, PBAP, BLE, SPP, OTA |
| FSC-BT1026C | Audio & Data | Customization |
Media Device